Iqela lophando lomphandi uYang Liang kwiZiko laseSuzhou leSifundo esiPhambili kwiYunivesithi yeSayensi kunye neTekhnoloji yaseTshayina liphuhlise indlela entsha yokuvelisa i-metal oxide semiconductor laser micro-nano, ethe yaqonda ushicilelo lwelaser lwezakhiwo ze-semiconductor zeZnO ngokuchaneka kwe-submicron, kwaye idityanisiwe. Ngokushicilela nge-laser yesinyithi, okwesihlandlo sokuqala yaqinisekisa ukubhalwa ngokuthe ngqo kwe-laser okudityanisiweyo kwezinto ezincinci ze-microelectronic kunye neesekethe ezinje ngeediode, iitriode, ii-memristors kunye neesekethe ze-encryption, ngaloo ndlela zandisa iimeko zokusetyenziswa kwe-laser micro-nano processing kwintsimi ye-microelectronics, i-electronics flexible, abenzi boluvo abaphambili, i-MEMS ehlakaniphile kunye nezinye iindawo zineembono ezibalulekileyo zesicelo. Iziphumo zophando zisanda kupapashwa kwi-"Nature Communications" phantsi kwesihloko esithi "Laser Printed Microelectronics".
I-elektroniki eprintiweyo bubuchwepheshe obuvelayo obusebenzisa iindlela zokushicilela ukwenza iimveliso zombane. Idibana neempawu zokuguquguquka kunye nobuntu besizukulwana esitsha seemveliso ze-elektroniki, kwaye iya kuzisa inguqu entsha yetekhnoloji kwishishini le-microelectronics. Kwiminyaka engama-20 edlulileyo, ushicilelo lwe-inkjet, ukuhanjiswa kwe-laser-induced transfer (LIFT), okanye ezinye iindlela zokushicilela zenze imitsi emikhulu ukuze kwenziwe izixhobo ezisebenzayo ze-organic kunye ne-inorganic microelectronic ngaphandle kwemfuneko yendawo ecocekileyo yegumbi. Nangona kunjalo, ubungakanani obuqhelekileyo bendlela yoshicilelo olungentla luqhele ukuba kulandelelwano lwamashumi eemicrons, kwaye luhlala lufuna inkqubo yobushushu obuphezulu bokusetyenzwa kwasemva kobushushu, okanye luxhomekeke kwindibaniselwano yeenkqubo ezininzi ukuphumeza ukusetyenzwa kwezixhobo zokusebenza. I-Laser micro-nano processing technology isebenzisa i-nonlinear interaction phakathi kwe-laser pulses kunye nezinto eziphathekayo, kwaye inokufezekisa izakhiwo ezisebenzayo kunye nokuveliswa okongeziweyo kwezixhobo ekunzima ukuzifumana ngeendlela zendabuko ngokuchaneka kwe-<100 nm. Nangona kunjalo, uninzi lwangoku lwe-laser micro-nano-fabricated izakhiwo zixhobo zepolymer enye okanye izinto zetsimbi. Ukungabikho kweendlela zokubhala ngokuthe ngqo kwe-laser kwizinto ze-semiconductor kwenza kube nzima ukwandisa ukusetyenziswa kwe-laser micro-nano yokucubungula iteknoloji kwintsimi yezixhobo ze-microelectronic.
Kule ithisisi, umphandi u-Yang Liang, ngokubambisana nabaphandi baseJamani nase-Australia, uvelise ngokutsha ukuprintwa kwe-laser njengobugcisa bokushicilela kwizixhobo zombane ezisebenzayo, ukuqonda i-semiconductor (ZnO) kunye nomqhubi (i-Composite laser yokushicilela izinto ezahlukeneyo ezifana ne-Pt kunye ne-Ag) (Umfanekiso 1), kwaye awufuni manyathelo enkqubo yasemva kobushushu obuphezulu konke konke, kwaye ubuncinci besayizi yefitsha yi <1 µm. Le mpumelelo yenza kube lula ukwenza uyilo kunye noshicilelo lwee-conductors, i-semiconductors, kunye nokwakheka kwezinto ezigqumayo ngokwemisebenzi yezixhobo ze-microelectronic, eziphucula kakhulu ukuchaneka, ukuguquguquka, kunye nokulawulwa kokushicilela izixhobo ze-microelectronic. Ngesi siseko, iqela lophando laqonda ngempumelelo i-laser edibeneyo yokubhalwa ngokuthe ngqo kwe-diode, i-memristors kunye neesekethe zokubethela ezingenakuphinda zivelise emzimbeni (Umfanekiso 2). Le teknoloji iyahambelana noshicilelo lwe-inkjet yendabuko kunye nobunye ubugcisa, kwaye kulindeleke ukuba yandiswe kushicilelo lweentlobo ezahlukeneyo ze-P kunye ne-N-uhlobo lwe-semiconductor yentsimbi ye-oxide, ibonelela ngendlela entsha ecwangcisiweyo yokusetyenzwa kwezinto ezinzima, ezinkulu, izixhobo ze-microelectronic ezisebenza macala amathathu.
Ithisisi:https://www.nature.com/articles/s41467-023-36722-7
Ixesha lokuposa: Mar-09-2023